| 摘要 |
An electronic component testing apparatus where a test is performed by pressing an input/output terminal (HB) of an IC chip (IC) to a contact portion of a test head. The testing apparatus has an IC moving device (410) for holding and moving the IC chip (IC) held by a holding portion (414) at its front face to which the input/output terminal (HB) is led and exposed, a first camera (415) for imaging the front face of the IC chip (IC) before it is held by the IC moving device (410), a second camera (420) for imaging the rear face of the IC chip (IC) held by the IC moving device (410), and an image processing device calculating the position of the input/output terminal (HB) of the IC chip (IC) held by the IC moving device (410) and specifying based on the calculated result the relative position of the input/output terminal (HB) of the IC chip (IC), held by the IC moving device (410), to the contact portion. The IC moving device (410) corrects the position of the IC chip based on the relative position specified by the image processing device.
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