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发明名称
METHOD FOR FORMING AN INSULATING LAYER HAVING AN AIR GAP AND METHOD FOR FORMING A COPPER METAL LINE USING THE SAME
摘要
申请公布号
KR20060005182(A)
申请公布日期
2006.01.17
申请号
KR20040054068
申请日期
2004.07.12
申请人
MAGNACHIP SEMICONDUCTOR, LTD.
发明人
MIN, WOO SIG
分类号
H01L21/31
主分类号
H01L21/31
代理机构
代理人
主权项
地址
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