| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer device which can eliminate the reason for damage of a wafer by keeping highly precise parallelism of a supporting plate for sucking a fragile plate-like object such as a wafer. SOLUTION: The transfer device 10 consists of the supporting plate 11 with the supporting surface 20A of a semiconductor wafer W, an arm plate 30 for supporting it, and a parallelism adjusting means 14 provided between the supporting plate and the arm plate 30. The supporting plate is provided to enable inlet/outlet of air from the supporting surface, and is held parallel to the wafer due to reaction in coming near the semiconductor wafer W in its air exhaust state, thus sucking and transferring the wafer after it comes into contact with the wafer kept parallel. COPYRIGHT: (C)2006,JPO&NCIPI |
