| 摘要 |
An integrated circuit package ( 50 ) may include an integrated circuit chip ( 22 ) having an integrated circuit ( 14 ). A lead frame ( 28 ) may be opposite the integrated circuit chip ( 22 ). The lead frame ( 28 ) may include at least one lead ( 30 ) electrically coupled to the integrated circuit ( 14 ) by a connector ( 42 ). The lead ( 30 ) may be within a periphery ( 32 ) of the integrated circuit chip ( 22 ). An encapsulant ( 44 ) may cover the integrated circuit ( 14 ), the connector ( 42 ) and a portion of the lead frame ( 28 ). A remaining portion of the lead frame ( 28 ) may be exposed from the encapsulant ( 44 ).
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