| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a maultilayer wiring board wherein uniformed and minute wires having enhanced adhesiveness with a conductor circuit layer and an insulation resin layer are formed on a smooth insulation board. SOLUTION: The manufacturing method includes the steps of (a) forming the insulation resin layer whose major component is an epoxy resin on a first conductor pattern optionally formed on the insulation board, (b) forming a graft polymer pattern on the insulation resin layer by coating a chemical compound including double bonds to the surface of the insulation resin layer and emitting ultraviolet rays in a form of a pattern, (c) forming a via-hole opening to the insulation resin layer before or after the step (b), (d) and applying plating to the insulation resin layer to form a second conductive pattern in response to the graft polymer pattern and via-holes and using the via-holes to electrically connect the second conductive pattern to the first conductive pattern, thereby forming a conductive path. COPYRIGHT: (C)2006,JPO&NCIPI |
