| 摘要 |
PROBLEM TO BE SOLVED: To provide a two-sided tape for LOC which satisfies both the adhesive characteristics with a metallic lead frame and characteristics with a semiconductor chip insulating film made of a plastic material and enables low-temperature bonding process, and to provide a manufacturing method therefor. SOLUTION: A two-sided tape for LOC consists of a polyimide base film having a glass transition temperature of 300°C or higher and a thickness of 5 to 150μm, an adhesive layer formed by applying a composition for a polyimide-base adhesive containing an acid end group to one side of the polyimide base film, and an adhesive layer formed by applying a composition for a polyimide-base adhesive containing an amine end group to the other side of the polyimide base film. The adhesive power, between the polyimide base film and each of the adhesive layers, is 0.8 kgf/cm<SP>2</SP>or larger. COPYRIGHT: (C)2006,JPO&NCIPI |
