| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power circuit package and a method of fabricating a power circuit package. <P>SOLUTION: The power circuit package includes: a base 12 that includes a plurality of interconnecting circuit layers 16 and via connection portions 22, 24, each of the interconnecting circuit layers having a substrate 14 and a substrate insulating layer 18 patterned to have substrate electrical interconnectors 20, while the plurality of interconnecting circuit layers is arranged to cover the overall substrate; and power semiconductor devices 28; wherein each of the power semiconductor devices includes a power semiconductor module 26 that includes a device pad 30 on the upper surface of each relevant power semiconductor device and a reverse side contact 31 on the lower surface of each relevant power semiconductor device, wherein the powder semiconductor devices are coupled to a film structure 32, which includes a film insulating layer 34 and a film electrical interconnector 36 that is arranged over the overall film insulating layer and extended selectively to the device pad, and wherein the reverse side contact 31 is coupled to a selected substrate electrical interconnector or the via connection portion. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
