发明名称 |
PRINTED CIRCUIT BOARD HAVING ELECTROMAGNETIC BANDGAP STRUCTURE |
摘要 |
A printed circuit board having an electromagnetic bandgap structure is provided to solve a mixed signal problem of an analog circuit and a digital circuit in an electronic device having a radio frequency circuit and a digital circuit on the same substrate. A printed circuit board having an electromagnetic bandgap structure includes an analog circuit, a digital circuit, a first metal layer(210-1), a second metal layer(210-2), a third metal layer(220), a metal plate(232), and a mushroom type structure(230). One of the first and second metal layers is a power layer. The other one of the first and second metal layers is a ground layer. The third metal layer is stacked between the first metal layer and the second metal layer. The metal plate is arranged in a space between circuit patterns of the third metal layer. The mushroom type structure has a via which is connected to the metal plate. |
申请公布号 |
KR100838246(B1) |
申请公布日期 |
2008.06.17 |
申请号 |
KR20070061833 |
申请日期 |
2007.06.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, HAN;KIM, HAK SUN;RYU, CHANG SUP |
分类号 |
H05K1/02;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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