| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of reducing manufacturing processes; and to provide a manufacturing method for manufacturing the same. SOLUTION: The semiconductor package includes a semiconductor device 10 having a first principal surface 11 and a second principal surface 12, a first electrode plate 20 provided on the first principal surface 11 side, a second electrode plate 30 provided on the second principal surface 12 side, and a wiring substrate 40 provided between the semiconductor device 10 and the first electrode plate 20. A plurality of opening portions 26 in the side surface of a protruding portion 22 provided on the first electrode plate 20 are engaged respectively with a plurality of engaging portions 45 which face the opening portions 26 and which are provided on the inner side surface of an intrusion opening portion 43 in the wiring substrate 40 into which the protruding portion 22 is intruded. In this way, the semiconductor package 1 is composed. COPYRIGHT: (C)2009,JPO&INPIT |
