| 主权项 |
1. A computer-implemented method for generating a defect sample for a wafer, comprising:
acquiring inspection results for the wafer, wherein the inspection results comprise information for defects detected on the wafer by an inspection process, and wherein the information comprises information for at least a first set of one or more first attributes for the defects and a second set of one or more second attributes for the defects; identifying values of the one or more first attributes having the most diversity in the values of the one or more first attributes; generating a set of bins for the defects based on the identified values such that each of the bins corresponds to only a portion of the values and such that the values corresponding to the bins have diversity in the one or more first attributes, wherein generating the set of bins does not include sampling any of the defects, wherein diversification of the set of bins in the one or more first attributes is controlled by a number of the bins in the set, and wherein the number of the bins in the set is received from a user prior to the generating step; separating the defects into the bins based on the values of the one or more first attributes corresponding to the defects, wherein separating the defects into the bins is not performed until after the set of bins have been generated; selecting, from one of the bins, defects within the one of the bins based on diversity in values of the one or more second attributes; repeating said selecting for at least one of the bins; and creating a defect sample for the wafer comprising the defects selected from the one of the bins and the at least one other of the bins, wherein said acquiring, said identifying, said generating, said separating, said selecting, said repeating, and said creating are performed by a computer system. |
