Substrate free LED package

摘要

A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

主权项

1. A method of fabricating a substrate free light emitting diode (LED), comprising:
disposing a wafer having a plurality of LED dies on a saw tape in a particular order; using a pick and place procedure to arrange the plurality of LED dies on a carrier tape to form an LED wafer assembly, wherein the plurality of LED dies are arranged on the carrier tape by grouping the LED dies such that each LED die within a group has a wavelength difference between LED dies that is within a predetermined threshold value, and wherein the LED wafer assembly is formed based on the grouping of the LED dies such that the LED dies in each group are all arranged on the carrier tape in a different order from the particular order on the saw tape; molding an encapsulation structure over at least one of the plurality of LED dies on a first side of the LED wafer assembly; removing the tape; and singulating the LED wafer assembly into predetermined regions comprising at least one LED.