发明名称 |
Display device using semiconductor light emitting devices |
摘要 |
A display device including a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices. Further, the conductive adhesive layer includes a body provided with a resin having an adhesive property; and a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound and aggregated with each other. |
申请公布号 |
US9627363(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514794305 |
申请日期 |
2015.07.08 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
Kim Chisun;Rhee Byungjoon;Shim Bongchu |
分类号 |
H01L25/07;H01L25/075;G09F9/33;H01L33/62;H01L33/20 |
主分类号 |
H01L25/07 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A display device, comprising:
a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices, wherein the conductive adhesive layer includes: a body provided with a resin having an adhesive property; a metallic aggregation part disposed in the body, and being aggregated metallic atoms precipitated from a metal-organic compound; metallic particles introduced into the body for accelerating the aggregation of the metallic atoms; and an additive including oleylamine for accelerating coupling of a metal reduced from the metal-organic compound, wherein the metallic aggregation part is configured to electrically connect the wiring electrode with a conductive electrode of the plurality of semiconductor light emitting devices, and wherein the metallic aggregation part includes the metal reduced from the metal-organic compound. |
地址 |
Seoul KR |