| 摘要 |
A semiconductor device assembly includes a semiconductor element mounted on a pedestal of a mounting plate. The mounting plate is secured between a pair of flanges, and co-axial terminals extend from the flanges. The co-axial terminals include outer ground plane walls and inner conductor pins electrically insulated from the outer walls. The conductor pins extend to the semiconductor element. The contacts of the semiconductor element are electrically connected to the mounting plate and conductor pins by short wires. A cover block is mounted on the flanges and extends over the semiconductor element. A retainer ring fits around the cover block and the flanges and firmly secures the cover block to the flanges.
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