发明名称 MEMS SILICON MICROPHONE AND MANUFACTURING METHOD THEREFOR
摘要 Disclosed are an MEMS silicon microphone and a manufacturing method therefor. By arranging a single crystal silicon vibrating diaphragm (2) above a multi-hole back plate silicon substrate (1), and separating same by a silicon dioxide layer (9) which is bonded with the multi-hole back plate silicon substrate (1) through a silicon-silicon bonding method, both of them form a capacitor structure of the microphone. In addition, the single crystal silicon vibrating diaphragm (2) has the advantages of low residual stress and good uniformity, and therefore, the sensitivity and the yield of the MEMS silicon microphone can be improved. The vibrating diaphragm (2) is provided with spring supports (7), bosses (8), micropores (11) and other structures, which can release the residual stress on the vibrating diaphragm (2) rapidly while avoiding the possibility of suction between the vibrating diaphragm (2) and the multi-hole back plate silicon substrate (1), further improving the yield and the reliability of the microphone. Therefore, the MEMS silicon microphone structure has features such as a simple production process, high sensitivity, low cost, good uniformity, and high reliability.
申请公布号 WO2016161670(A1) 申请公布日期 2016.10.13
申请号 WO2015CN77281 申请日期 2015.04.23
申请人 MICROLINK SENSTECH SHANGHAI LTD. 发明人 MIAO, Jianmin
分类号 H04R31/00;H04R19/04 主分类号 H04R31/00
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