| 发明名称 | Multilayer ceramic electronic component and board having the same | ||
| 摘要 | A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively. | ||
| 申请公布号 | US9491847(B2) | 申请公布日期 | 2016.11.08 |
| 申请号 | US201514921867 | 申请日期 | 2015.10.23 |
| 申请人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 发明人 | Park Sang Soo;Lee Byoung Hwa;Ahn Young Ghyu;Park Heung Kil;Oh Hyun Sub |
| 分类号 | H01G4/224;H05K1/02;H01G4/12;H01G4/236;H01G4/30;H05K1/18;H05K1/03 | 主分类号 | H01G4/224 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A multilayer ceramic electronic component comprising: a board including first and second contact terminals which are disposed on one surface thereof to be spaced apart from each other in a length direction, and first and second external terminals which are disposed on the other surface thereof to be spaced apart from each other in the length direction; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions which are disposed on opposite end surfaces of a ceramic body and first and second band portions which extend from the first and second connection portions to portions of one surface of the ceramic body in a thickness direction thereof, respectively, the first and second band portions being connected to the first and second contact terminals of the board, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the exposed ends of the first and second contact terminals and the first and second external terminals to each other, respectively. | ||
| 地址 | Suwon-Si, Gyeonggi-Do KR | ||