| 摘要 |
A variety of connection devices, and methods for their manufacture, having contact members which make contact with conductive pads of printed circuit boards, the pads being pitched at 0.25mm or thereabouts. Each contact member comprises a resilient strip of conductive material which, in order to accommodate pad irregularities, is shaped to present two contact-making crests spaced from each other along the length of the strip, and joined to each other by an intervening loop of the strip.
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