ELECTROCONDUCTIVE PASTE COMPOSITION AND STRUCTURES FORMED THEREFROM

摘要

A resistor and conductor paste compositions and structures formed therefrom for hybrid integrated circuits are disclosed in which a metal which substantially contributes the electrical conductivity is coated over micron-sized glass particles the metal coated particles are then mixed and fused into a glass matrix the whole adhering to a ceramic substrate. This structure results in greater conductivity for a given quantity of the metal.