发明名称 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
摘要 This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
申请公布号 WO2016172092(A1) 申请公布日期 2016.10.27
申请号 WO2016US28262 申请日期 2016.04.19
申请人 FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 发明人 MALIK, Sanjay;SAKAMURI, Raj;DIMOV, Ognian N.;DE, Binod B.;REINERTH, William A.;NAIINI, Ahmad A.
分类号 G03F7/075;C08G73/10;G03F7/004;G03F7/027 主分类号 G03F7/075
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