发明名称 Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
摘要 <p>Contact blobs are formed at the ends of lead wires for electric, preferably semiconductor, components in a process using a direct current light arc, whose current has been stabilised to a desired current strength, while the duration of the light arc has been limited to a certain time period. The equipment contains a high voltage storage capacitor (2) whose discharge circuit incorporates the arc spark gap (b) between the lead wire (3) and a counter-electrode (7). The capacitor discharge circuit contains an electron tube in grid-base connection and a current stabiliser, both in line with the arc spark gap.</p>
申请公布号 CH568656(A5) 申请公布日期 1975.10.31
申请号 CH19740003817 申请日期 1974.03.20
申请人 TRANSISTOR AG 发明人
分类号 B23K20/00;H01L21/60;(IPC1-7):01L23/48;01R43/02 主分类号 B23K20/00
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