| 发明名称 | Flexibly-wrapped integrated circuit die | ||
| 摘要 | Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate. | ||
| 申请公布号 | US9515049(B2) | 申请公布日期 | 2016.12.06 |
| 申请号 | US201314368434 | 申请日期 | 2013.12.19 |
| 申请人 | Intel Corporation | 发明人 | Albers Sven;Skinner Michael;Barth Hans-Joachim;Baumgartner Peter;Gossner Harald |
| 分类号 | H01L25/065;H01L23/552;H01L23/522;H01L29/06;H01L23/00;H01L27/02 | 主分类号 | H01L25/065 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. A flexibly-wrapped integrated circuit die device comprising: a substrate; an integrated circuit die coupled to the substrate; a flexible integrated circuit die, the flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate wherein the flexible integrated circuit die substantially peripherally encircles the integrated circuit die; and a tube coupled to the substrate and substantially encircling the flexible integrated circuit die. | ||
| 地址 | Santa Clara CA US | ||