| 摘要 |
To provide a method of mounting electric parts on a surface mounting substrate whereby it is possible to accurately set the stand-off height of a chip part. The method includes a step of forming a thick film resist layer by applying a resist with a thick film coating device to a mounting surface of a surface mounting substrate on which is formed a wiring pattern including a pair of lands on which to mount an electronic part, a step of precuring the formed thick film resist layer, a step of exposing exposure regions using a mask with inner side regions of the thick film resist layer, which are on the lands and to be below the electronic part, as the exposure regions and with the other regions as non-exposure regions, a step of etching away the thick film resist layer in the non-exposure regions and thus forming thick film resist layers in the inner side regions which are on the pair of lands and to be below the electronic part, a step of post curing the thick film resist layers, a step of printing solder pastes in regions on the lands excluding the inner side regions, and a step of placing the electronic part on the solder pastes and carrying out reflow soldering thereon. |
