| 摘要 |
1469973 Semi-conductor devices ASEA AB 11 June 1974 [12 June 1973] 25791/74 Heading H1K A semi-conductor device 13 is enclosed in a box comprising a bottom 10, 11 and a metallic lid 1, 2 on either side of the device 13, and two insulating rings 3, 12 fixed to each other via a metallic ring 6 to which a control electrode 7 is connected, the control electrode 7 extending across the ring 6 and having a projecting contact part 8 which is pressed against the device 13 only through the anchoring of the electrode 7 to the ring 6. The ring 6 and the electrode 7 are preferably formed in one piece by punching out from a metal sheet and the insulating rings 3,12 are ceramic. The lid part 2 is fixed to the ring 3 by brazing or by epoxy resin adhesive and the bottom part 11 and the ring 12 are similarly secured. In an alternative embodiment, rings (6a, 15), Fig. 8 (not shown), are respectively secured to the rings 3, 12 and joined together by soldering or welding. The device may be provided with a cooling body. The device is may be a Si thyristor and the metallic parts 1, 2, 10, 11 may be Cu, Fe, Fe-Ni alloy or Fe-Ni-Co alloy. |
