Optical module

摘要

A flexible wiring board includes a conductive film provided on one surface of a substrate. The conductive film includes a plurality of pad portions to which a plurality of connection electrodes are respectively bonded with solder, and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged. The plurality of pad portions include a terminal portion electrically connected with the wiring portion, and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion. The solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion. The land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.

主权项

1. An optical module comprising:
an optical sub-assembly for converting an electric signal and an optical signal at least from one to the other; a flexible wiring board; and solder electrically connecting the optical sub-assembly with the flexible wiring board, wherein the optical sub-assembly includes a plurality of connection electrodes arrayed so as to be arranged in at least a row, the flexible wiring board includes a substrate having flexibility and a conductive film provided on one surface of the substrate, the conductive film includes a plurality of pad portions to which the plurality of connection electrodes are respectively bonded with the solder and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged, the plurality of pad portions include a terminal portion electrically connected with the wiring portion and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion, the solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion, and the land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.