发明名称 HEAT CURING ORGANIC SILICONE COMPOUND AND ITS PRODUCTION METHOD
摘要 1515651 Silicone rubber compositions curable by heat and moisture DOW CORNING CORP 10 Jan 1977 [15 Jan 1976] 0705/77 Heading C3T An anhydrous composition, heat-curable in the presence of moisture, comprises (A) 100 p.b.w. of a vinyl-terminated polydiorganosiloxane, free of SiOH and hydrolysable groups, of viscosity at least 1 Pa-sec. but less than 100 Pa-sec. at 25‹ C., having hydrocarbyl and/or fluorinated hydrocarbyl organic groups, at least 50% being methyl groups; (B) 3-10 p.b.w. of an alkenyl triacetoxysilane; (C) 0À1-10 p.b.w. of an organic peroxy compound; and (D) 10-300 p.b.w. of a filler. In the examples 100 p.b.w. of vinyl-terminated polydimethylsiloxane of 55,000 cP/25‹ C. is mixed mixed with 3 p.b.w. fume silica, 0À85 p.b.w. hydroxy - terminated methyl phenyl polysiloxane (500 cP/25‹ C.), 69 p.b.w. of 5 micron quartz, or 36 of this plug 33 p.b.w. of CaCO3, 3 p.b.w. Fe2O3 and 6 p.b.w. of a 1 : 1 mixture of 2 - 4-dichlorobenzoyl peroxide and a silicone oil; to this is added 4À15 or 5À45 p.b.w. ViSi(O.CO.CH3)3; the samples are cured in 50% relative humidity at 150‹ C. for 10 mins. and adhere well to Al, steel and glass.
申请公布号 JPS5287455(A) 申请公布日期 1977.07.21
申请号 JP19760141743 申请日期 1976.11.25
申请人 DOW CORNING 发明人 HARORUDO BAAN REFURAA ZA SAADO
分类号 C08L83/00;C08K5/14;C08K5/5425;C08L83/04 主分类号 C08L83/00
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