Method and apparatus for forming a uniform solder wave

摘要

A tapered array of apertures are provided in a wall of a solder pot to permit passage of molten solder therethrough. Molten solder is pumped along an outside channel, perpendicular to the axes of the apertures, and through the apertures to cause the solder pot to overflow with a uniformly distributed wave. The array tapers in the direction of pumped fluid flow.