| 摘要 |
<p>A heat sink mount for a pressurized semiconductor device is formed in two extrusion stages including a first bi-metal extrusion stage in which a steel ring brazed to the top of a copper billet is extruded together with the main body of copper to form a cup at the top of the main body defined by a depending collar integral with said ring and a mounting stem, a tube with a flared lower end is placed in the cup and a second extrusion is performed on the main body to cause flow of the collar material and to lock it into the flared end of the tube to form a tight joint.</p> |
