METHODS OF MAKING SEMICONDUCTOR DEVICES

摘要

1520051 Semiconductor devices SONY CORP 9 March 1976 [17 April 1975] 09347/76 Heading H1K. In a process of making a semiconductor device, in particular an IGFET or a bipolar transistor, after forming a masking layer 15, Fig. 2c, typically of SiO 2 or polycrystalline silicon containing nitrogen, on a polycrystalline silicon layer 14 containing 2-45 atomic per cent of oxygen atoms, windows, e.g. 9, 10, 16 are provided in the masking layer 15, and the polycrystalline silicon layer exposed in the windows is then oxidized to form regions 29, 30, 18. In the case of an IGFET, the oxidized regions 29, 30 are removed by a conventional photo-etching method to expose diffused source and drain regions 11, 12 respectively, and the respective electrodes (19, 20), Fig. 2E (not shown), and a gate electrode 21 on the oxidized region 18 are then provided. A complementary IGFET may be provided in the same substrate. The polycrystalline silicon layer 14 having a thickness of 1,000 Š is formed by chemical vapour deposition method using a furnace supplied with monosilane, dinitrogen monoxide, ammonia, and a carrier gas such as N 2 , the flow ratio of nitrogen monoxide to monosilane being controlled so as to have 35 atomic per cent of oxygen in the layer 14. When preparing a mask (44), Fig. 4 (not shown) of polycrystalline silicon containing 50 atomic per cent of nitrogen, ammonia gas instead of dinitrogen monoxide gas is used. When the masking layer is of silicon dioxide, it is thicker than the polycrystalline silicon layer 14, windows in the making layer may be made by plasma-etching method.