| 发明名称 |
PRODUCTION OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To simplify assembling operation by beforehand selectively printing adhesive agents on the lead frame and pellet mounting part on a heat sink.</p> |
| 申请公布号 |
JPS53117968(A) |
申请公布日期 |
1978.10.14 |
| 申请号 |
JP19770032193 |
申请日期 |
1977.03.25 |
| 申请人 |
HITACHI LTD |
发明人 |
YOSHIDA HISASHI |
| 分类号 |
H01L23/50;H01L21/58;H01L21/60;H01L23/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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