Photonic transceiving device package structure

摘要

The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

主权项

1. An apparatus for packaging a photonic transceiver comprising:
a case, comprising a base member, two partial side members being connected by a joint piece and coupled to the base member, a lid member including a cover coupled to the two partial side members and the base member to provide a spatial volume with an opening at a back end of the base member; a PCB, installed inside the spatial volume over the base member, including a board body extended from a front edge to a back edge, the back edge being near the opening at an back end of the base member, the board body comprising an array of metallic pin stripes at the back edge to form a pluggable electrical interface connector; one or more optical transmitting devices, each being mounted upside-down on the PCB near the front edge and including a TEC module being in thermal contact with the lid member and a laser output port aiming toward the back edge; a silicon photonics chip, mounted on the PCB, including a fiber-to-silicon attachment module to couple with a first fiber from each of the laser output port, and an optical input port and an optical output port disposed together on a front end of the base member near the joint piece for the two partial side members and respectively back connected via a pair of second fibers to the fiber-to-silicon attachment module.