摘要 |
A light-emitting element includes: a light transmissive substrate having a first main surface, a second main surfaces, a first lateral surface, a second lateral surface, a third lateral surface, and a fourth lateral surface; a semiconductor layered body; a first light reflection member; and a second light reflection member. A cross-sectional plane of the light transmissive substrate perpendicular to the first main surface and intersecting with the third lateral surface and the fourth lateral surface has a first concave figure having a first recess. The deepest portion of the first recess is arranged on an inner side of an outer periphery of the semiconductor layered body. The third lateral surface includes one or more surfaces defining the first recess. |
主权项 |
1. A light-emitting element comprising:
a light transmissive substrate having a first main surface, a second main surface opposite to the first main surface, a first lateral surface adjacent to the first main surface and the second main surface, a second lateral surface opposite to the first lateral surface, a third lateral surface adjacent to the second lateral surface, and a fourth lateral surface opposite to the third lateral surface; a semiconductor layered body formed on the first main surface of the light transmissive substrate; a first light reflecting member covering the first lateral surface, the second lateral surface, the fourth lateral surface, and the second main surface of the light transmissive substrate; and a second light reflecting member covering a surface of the semiconductor layered body that is opposite from a surface on which the light transmissive substrate is disposed, wherein, in the light transmissive substrate, a cross-sectional plane of the light transmissive substrate that is perpendicular to the first main surface and intersects with the third lateral surface and the fourth lateral surface has a first concave figure having a first recess, the deepest portion of the first recess is arranged on an inner side of an outer periphery of the semiconductor layered body, and the third lateral surface includes one or more surfaces defining the first recess. |