发明名称 METHOD OF RELATIVELY POSITIONING PROJECTING MASK AND SEMICONDUCTOR WAFER
摘要 In an illustrative embodiment marks with dual x-ray permeable apertures are at three spaced locations on the mask and transmit x-ray beams which are directed obliquely to the semiconductor surface. In this case, the marks on the semiconductor disc may be formed by monocrystals shaped in conformity with the incident beam cross section and located so as to produce reflected x-ray beams which intersect correspondingly shaped further apertures of the respective dual aperture marks on the mask. Alternatively the beams may impinge on the surface of the semiconductor disc itself at an angle to produce reflection, with x-ray absorbing material surrounding each reflecting region. In either case the reflected beams as transmitted by the further apertures are detected as a measure of the degree of parallelism of the mask and semiconductor disc.
申请公布号 JPS53148285(A) 申请公布日期 1978.12.23
申请号 JP19780062787 申请日期 1978.05.25
申请人 SIEMENS AG 发明人 ETSUKARUTO FUNTO
分类号 H01L21/027;G03F9/00;G03F9/02 主分类号 H01L21/027
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