| 摘要 |
A method of forming a connector assembly in association with a hybrid circuit by soldering a plurality of relatively rigid connectors thereto, the resulting assembly being capable of self-supporting the hybrid circuit without the use of ancillary mechanical supporting devices when plugged into a suitably configured printed circuit board or the like. According to the method, a predetermined amount of solder paste is deposited on each of the hybrid circuit substrate terminal pads and one end of each of the rigid connectors is positioned on a respective one of the thusly formed solder paste fillets. Heat is then applied to the substrate reflowing the solder paste fillets and thereby enveloping the terminal pads and their associated connectors for achieving a high strength non-mechanically supported solder connection between each of the connectors and its associated terminal pad. In one embodiment of the invention, two such hybrid circuit-connector assemblies are formed simultaneously.
|
