| 发明名称 |
SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND STRUCTURE |
| 摘要 |
Provided is a sealing resin composition comprising an epoxy resin (A), a phenol aralkyl resin (B) having a biphenylene scaffold, and a compound (C) having only one phenolic hydroxyl group. The compound (C) comprises a compound represented by formula (1). |
| 申请公布号 |
WO2016194034(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
WO2015JP65523 |
申请日期 |
2015.05.29 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
YOSHIDA Kenji |
| 分类号 |
C08G59/62;C08K5/13;C08L63/00 |
主分类号 |
C08G59/62 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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