| 发明名称 |
Electroless copper plating process with dissolved oxygen maintained in bath |
| 摘要 |
Copper is electrolessly deposited on a surface wherein the dissolved oxygen content is maintained between 2 and 4 ppm in the plating bath.
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| 申请公布号 |
US4152467(A) |
申请公布日期 |
1979.05.01 |
| 申请号 |
US19780885415 |
申请日期 |
1978.03.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
ALPAUGH, WARREN A;ZUCCONI, THEODORE D |
| 分类号 |
H05K3/18;C23C18/30;C23C18/31;C23C18/40;(IPC1-7):C23C3/02 |
主分类号 |
H05K3/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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