| 摘要 |
PURPOSE:To enable mounting with compactness and air tight sealing for the electronic components and the lead frame of surrounding, by electrically connecting the electronic components such as IC's on the lead frame providing nuts. CONSTITUTION:The lead frame is made of kovar plate about 0.15mm thick and each external lead of IC's, wiring leads for externally mounted electronic components and the plate nuts 2 are formed. The nut 2 is made of kovar plate, and the diameter d of the hole 2c is equal to the inner diameter of screw, and the length l of the notch 2b is the value d subtracted by the screw external diameter approximately. The screw 20 is screwed to the diameter d and tightened. Since the nuts are fitted to the lead frame like this, no nut as separate component is required, and the number of components is decreased and assembling man-hours can be reduced. Further, electronic components can be tightened softly by using the spring nature of the plate nuts. Thus, the electronic components can be mounted with compactness. |
