| 摘要 |
The present invention relates to a pane with an electrical connection element, comprising a substrate made of glass (1) with a first coefficient of thermal expansion, an electrically conductive structure (2) with a layer thickness of from 5 to 40 μm on a region of the substrate (1), a connection element (3) with a second coefficient of thermal expansion, wherein the difference between the first and second coefficients of thermal expansion is ≥5×10/°C, a layer of soldering compound (4), which electrically connects the connection element (3) to subregions of the electrically conductive structure (2), wherein the soldering compound (4), which exceeds a layer thickness t of 50 μm, emerges from the interspace between the connection element (3) and the electrically conductive structure (2) with an exit width b<1 mm, in relation to the contact face of the connection element (3). |
