| 摘要 |
PURPOSE:To achieve vacuum for the detection elements without damage, by chipping off the package for adsorbing film source, after forming the gas adsorption film layer at a part of the inside wall of the vacuum package through projecting the gas adsorption film source package activated at a part of the vacuum package. CONSTITUTION:At the center of the upper end closed side of the cylindrical glass made vacuum package 11, the concave 12 for cooling is formed, and the entire cross section is made to U shaped form. Further, at the rear bottom of the concave 12, the semiconductor detection element 13 is fitted, and the leads 14a and 14b connected to it are drawn out externally through the upper end wall of the package 11. Further, at a part of the upper end wall of the package 11, the cylindrical glass made gas adsorption source package 15 the upper end of which is choked is projected at a part of the upper end wall of the package 11 via the narrow cross section part 16, and this is supported with the leads 18a and 18b which pass through the upper end wall. Further, at the lower opening of the package 11, the pot 19 made of Ge is bonded to constitute the detection window 20. With this constitution, the package 11 is made to vacuum, the film 17 in the package 15 is made active by flowing current to it, the film layer 21 is attached to the inner wall of the package 11, and chipping off is made at the narrow cross section 16.
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