| 摘要 |
<p>PURPOSE:To improve efficiency of separation works that are required when a semiconductor substrate with a P-N junction is divided into a number of pellets, by dividing the substrate while holding a first sheet thereon and sticking a second sheet on the surface having no sheet and then stripping off the first sheet. CONSTITUTION:A vinyl resin thin film 12 is deposited on the rear surface of a semiconductor substrate 11 on which a P-N junction is formed, and a first sheet 13 having layer 14 of acrylic adhesive is sticked on the surface of the film 12. The substrate 11 is then divided into several pallets 17 by forming separation grooves 16 from its surface, including the P-N junction, by means of a cutting saw, and pulling the sheet 13 in the outer peripheral divection. In the next step, a second sheet 19 provided with an adhesive layer 18 is pasted on the surface 20 of the pellet 17 located opposite the first sheet 13, and then the first sheet 13 is stripped off, leaving the pallets 17 on the second sheet 17. Under such condition, the pallets can be easily separated from the second sheet 19.</p> |
