发明名称 |
POLYPARABANIC ACID LAMINATES |
摘要 |
This invention relates to processes and techniques for forming metal and/or plastic/polyparabanic acid (PPA) laminates particularly for use as a component of electrical and electronic systems, especially as flexible circuit materials. Laminate species not requiring intermediate adhesive layers, not fabricated from preformed PPA films and not requiring subsequent cross-linking or other curing reactions are preferred. Solvent casting of PPA is a preferred method of preparing such laminates. |
申请公布号 |
CA1070575(A) |
申请公布日期 |
1980.01.29 |
申请号 |
CA19750222520 |
申请日期 |
1975.03.19 |
申请人 |
EXXON RESEARCH AND ENGINEERING COMPANY |
发明人 |
HENDERSON, DON J. |
分类号 |
B32B15/04;B05D7/02;B05D7/14;B05D7/16;B32B15/08;B32B15/088;B32B27/00;C08J7/04;H05K1/00;H05K1/03;H05K3/38 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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