| 摘要 |
The method forms a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates. Exposing a first and second polymer sheet or film of a curable polymer to an energy source creates an exposure pattern in the first and second polymer sheet, the exposure pattern having elongated sections exposed to the energy source. Then removing polymer from the exposed first and second polymer sheets to forms elongated channels through the first and second polymer sheets in a channel pattern that corresponds to the exposure pattern. Attaching the first and second polymer sheets forms a polishing pad, the patterns of the first and second polymer sheets cross wherein the first polymer sheet supports the second polymer sheet and the elongated channels from the first and second polymer sheets connect and to form the layered-open-network polishing pad. |
