| 摘要 |
PURPOSE:To miniaturize the microwave device by forming the external circuit and the electromagnetic connection part into one chip in the form of the IC substrate and then fitting the chip into the slit which is formed previously at part of the semi- coaxial resonator. CONSTITUTION:Three slits 22-1, 22-2 and 22-3 which are extending toward the axis are formed about equidistantly on the bottom surface of semi-coaxial resonator 21. Three microwave semiconductor integrated circuit substrate are mounted to these three slits respectively. These three substrate are classified into those for phase detection, oscillation and frequency control purposes each, consisting roughly of external circuit 42 on the surface of substrate 41 made of the sapphire and electromagnetic connection part 43 led out of circuit 42. And the electromagnetic connection is given between part 43 and resonator 21 via the slit. |
