发明名称 Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device
摘要 There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein,; and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.
申请公布号 US9488911(B2) 申请公布日期 2016.11.08
申请号 US201514831801 申请日期 2015.08.20
申请人 FUJIFILM Corporation 发明人 Tsuchimura Tomotaka;Sakita Kyouhei
分类号 G03F7/004;G03F7/20;G03F7/32;G03F7/039;G03F7/038;C07D277/64;C07D277/84;C07D413/12 主分类号 G03F7/004
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A photosensitive composition containing a compound represented by the following Formula (I): in Formula (I), Y represents a monovalent organic group that is heterocyclic, R1 represents a monovalent organic group, each of R2 and R2′ independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a heteroaryl group, and R2 and R2′ may be bound with each other to form a nitrogen-containing heterocyclic group.
地址 Tokyo JP