| 摘要 |
PURPOSE:To enhance the productivity of a hybrid integrated circuit by forming the height of a pad higher than that of other electronic parts and employing a wire wedge cutting type ultrasonic wire bonding unit. CONSTITUTION:A semiconductor chip 5, a chip capacitor 6 and a pad 7 are bonded with solders 4 onto a ceramic substrate 3 formed with a thick film circuit to form a power transistor portion and a hybrid integrated circuit thereon. The pad 7 is formed thicker than the thickness of the chip capacitor 6 and the semiconductor chip 5. Therefore, a capillary 40 operating integral with a wedge 30 may not contact with the electronic component such as the chip capacitor 6 or the like, and aluminum wire can be bonded with ultrasonic wave for bonding the transistor chip 8 to the pad 7. |
