发明名称 BOILING COOLER
摘要 PURPOSE:To facilitate installation work, by mold-fixing a radiation fin inside a casing made of an insulator and having a space for filling a coolant and by providing a pipe which is located outside the space distantly from the radiation fin and serves to connect a cooler and a condenser to each other. CONSTITUTION:An annular space 17 for filling a coolant is formed in a casing 16 which is made of an insulator and extends vertically. A radiation fin 18 is mold- fixing inside the space 17. The fin is provided with a pair of annular recesses 19 to facilitate sealing-up and securing. A connection pipe 20 is mold-fixing outside the space 17 and electrically insulated from the fin 18 and communicates with the space. The front end of the pipe 20 is expanded to facilitate sealing-up and securing. Mounting holes 21 are provided at the four corners of the casing 16 so that the holes are located at a distance from the space. Since the pipe 20 is coupled to a condenser 6 through a bellows 8 only, the positioning of a boiling cooler 15 in the replacement of a semiconductor unit 11 is facilitated and simplified.
申请公布号 JPS564258(A) 申请公布日期 1981.01.17
申请号 JP19790080916 申请日期 1979.06.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITANO SHIYOUGO
分类号 H05K7/20;F25D9/00;H01L23/427 主分类号 H05K7/20
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