| 摘要 |
The present invention relates to a solder pad structure for increasing solder joint reliability of a semiconductor chip package, the solder pad structure comprising: a first solder pad formed on the lower portion of the semiconductor chip package; and a second solder pad that is provided on one surface of a printed circuit board on which the semiconductor chip package is mounted so as to correspond to the first solder pad and to which solder is joined, wherein the first solder pad has a first joint portion formed thereon which protrudes downward in a convex dome shape and to which the upper surface of the solder is joined, and the second solder pad has a second joint portion formed thereon which protrudes upward in a convex dome shape and to which the lower surface of the solder is joined. According to the present invention, when the semiconductor chip package is mounted on the printed circuit board (PCB), the protruding dome structures are employed for the interfaces of the solder pads that are joined with the solder, which makes it possible to minimize stress generated between the solder and the pads by external heat, vibration, and shock to significantly improve the reliability of the electronic component. |
