| 摘要 |
PURPOSE:To obtain the wiring free of short-circuit defects for the subject semiconductor with a plurality of semiconductor elements connected by a bonding wire by a method wherein a floated lead without an external terminal is provided and a wiring performed using said terminal as a junction section. CONSTITUTION:For application to signal-phase bridge rectifying circuit, parts of the lead L1 and L3 are formed into two branches and a lead L5 without an exterior terminal is prepared. On the lead frame as prepared above, diodes D1, D2, D3 and D4 are connected respectively, and each electrode is wire-connected to the corresponding lead. In this case, firstly, the diode D1 electrode is wire-connected to the part L5 and then it is wire-connected to the part L2 of the lead through the electrode of the diode D4 located on the part L4 of the leaf. Consequently, as a jumping wiring can be eliminated by utilizing the floating lead and the electrode of the element as a junction section, the short-circuit caused by the deformation of a wire and the like can be prevented. |
