发明名称 METHOD OF INDIRECTLY CONNECTING TWO PARTS
摘要 <p>A method of indirectly connecting two parts, such as an acousto-optical building component composed of lead glass and a piezo electric transducer composed of lead-zirconium titanate, whereby at least one mono-molecular layer (having a maximum thickness of 100 nm) composed of a lead-free glass is directly applied under vacuum onto the surfaces of the parts to be joined and metal layers are then applied under vacuum onto such glass layer and/or the surfaces to be joined so that when the free surfaces of such free metal layers are brought into contact with one another under vacuum, a bond forms therebetween and such bonds indirectly connect the parts with one another. The glass layer prevents diffusion of atoms or ions from the materials (such as lead) on either side of such layer so that the parts so-joined and/or the bonds so-formed are not impaired in any way.</p>
申请公布号 CA1105248(A) 申请公布日期 1981.07.21
申请号 CA19780311769 申请日期 1978.09.21
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BURKART, KLAUS;WINTZER, MANFRED
分类号 G02F1/11;B23K20/24;B23K35/00;C03C27/08;C04B37/00;G02F1/33;(IPC1-7):23K1/20 主分类号 G02F1/11
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