| 摘要 |
PURPOSE:To generate a ball surely when the ball is to be formed with a fine metal wire using the electric torch of a wire bonder being used to assemble the semiconductor element by a method wherein a voltage is applied after short-circuiting between the fine metal wire and the electric torch is detected preliminary. CONSTITUTION:The semiconductor element 8 is put on a die pad 9, and is connected to a lead wire 10 with the fine metal wire 6. When the electric torch 2 comes under a capillary chip 5 for the wire bonder holding the fine metal wire, a voltage being not so large as to generate a spark between the electric torch and the fine metal wire is applied to the cable. When the both are short-circuited, a current flows. This is checked with a current detector 2. When no current is flowing, the normal voltage to generate a spark is applied to form the ball 7. Accordingly wire bonding can be performed surely with favorable precision. |
