发明名称 Soldering appts. using hot air streams as heat source - esp. for soldering or de:soldering electronic components on printed circuit boards
摘要 <p>Fan and vertical chamber (a) are used to blow air through an upper horizontal chamber (b) and a lower horizontal chamber (c). Each chamber (b,c) contains an electric resistance air heater; and a work-table is fixed to chamber (a). A substrate, esp. a printed circuit board, can be placed on the work-table so that nozzles on chambers (b,c) can provide hot air streams for soldering or desoldering operations. Chambers (b,c) pref. contain baffles creating turbulent hot air streams; and at least one of these chambers (b,c) is pref. telescopic and can be aligned above a hole in a substrate with the aid of a guide. Appts. is portable, and can be carried in a small suitcase. It also includes a jig for straightening rows of connector pins prior to soldering.</p>
申请公布号 FR2484883(A3) 申请公布日期 1981.12.24
申请号 FR19810011999 申请日期 1981.06.18
申请人 SPERRY CORP 发明人 RONALD ALEXANDER BECK
分类号 B23K1/012;(IPC1-7):23K1/12;05K3/34 主分类号 B23K1/012
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