发明名称 Electronic component unit and wire harness
摘要 An electronic component unit includes a plate made of a resin material configured to embed metallic bus bars in the resin material and mount electronic components thereon, and a supporting member to which the plate is assembled. The plate has a plurality of exposed ends at which the bus bars are partially exposed on edge surfaces of the plate. The supporting member includes protrusions that are formed on opposed surfaces facing the edge surfaces of the plate such that the protrusions face the edge surfaces of the plate, protrude from the opposed surfaces toward the edge surface sides of the plate, and are each located between the adjacent exposed ends in an arrangement direction of the multiple exposed ends.
申请公布号 US9496693(B2) 申请公布日期 2016.11.15
申请号 US201514692127 申请日期 2015.04.21
申请人 YAZAKI CORPORATION 发明人 Maebashi Akemi;Akanitsuk Pharima;Shiraiwa Hiroki;Tokumasu Yasuhiro
分类号 H05K5/00;H01B7/00;H02G3/08;B60R16/023;H01B17/14;H05K7/02 主分类号 H05K5/00
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. An electronic component unit comprising: a plate made of a resin material configured to embed a metallic bus bar in the resin material and mount an electronic component thereon; and a supporting member to which the plate is assembled, wherein the plate has a plurality of exposed ends at which the bus bar is partially exposed on an edge surface of the plate, and the supporting member includes a protrusion that is formed on an opposed surface of the supporting member facing the edge surface of the plate such that the protrusion faces the edge surface of the plate, protrudes from the opposed surface toward the edge surface side of the plate, and is located between the adjacent exposed ends in an arrangement direction of the plurality of exposed ends, wherein the plate has a width, a length, and a height, the height being shorter than each of the length and the width, wherein the edge surface of the plate is defined by the height and one of the width and the length, and wherein a main surface of the plate, which is configured to mount the electronic component therein, is defined by the length and the width.
地址 Tokyo JP